The latest research report on Flip Chip Market
Global flip chip technology market was valued at USD 20.61 billion in 2017 and expected to grow at CAGR 5.9% over the forecast period 2019–2026.
Global Flip Chip Market Report (Industry Analysis, Applications, Growth, Trends) and Future Forecast (2016-2026) is the latest report published by Straits Research which is committed to delivering details of the Flip Chip industry.
Straits Research offers a high level of accuracy, an in-depth valuation, and systematic research methodology to the reader that helped to collect the info from direct as well as indirect sources. Forecasting patterns were considered across the various regions where the Flip Chip industry is growing steadily. The report has taken a deep dive into the market and has extracted the data from secondary and primary sources.
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Flip chip is a packaging technology that interconnects the chip and substrate of a package carrier using a bump. These bumps are placed on a die surface and help make an electrical interconnection between the chip and the package substrate. Any surface of a flip chip can be used for interconnection, generally done through copper, nickel or solder metal bumps. Technological superiority over wire bond connections, increasing demand for high functionality devices, maintaining high packaging density, and increasing reliability of circuits are some of the factors driving the flip chip market.
Flip chips offer a wide variety of benefits as compared to wire-bond packagings, such as substrate flexibility, superior electrical and thermal and electrical performance, high speed and reliability. Current leading-edge flip-chip designs are in production with as many as 5,908 bumps/chip at 200-µm pitch and 1,500 bumps/chip at 170-µm pitch in area array configurations.
Some of the prominent players in the global flip chip market include Intel Corporation, IBM Corporation, Amkor Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, Samsung Electronics Co. Ltd, Texas Instruments Inc., GlobalFoundries U.S. Inc., Stats ChipPAC Ltd, Nepes Pte Ltd., and Powertech Technology
The Flip Chip Market is segmented into different sections such as by type, by application, by end users, and by regions. The report about the Flip Chip industry covered the markets by analyzing the top players participating in the market. To make this report an exceptional one, several parameters are models are used which include SWOT analysis, Porters five force model, and pestle analysis.
Development in technology and innovations have created an educated workforce which ultimately witnessed in increasing per capita income and this particular factor has positively impacted on the growth of the Flip Chip market since the past few years.
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By Packaging Technology, 3D IC, 5D IC, 2D IC,
By Bumping Technology, Copper Pillar, Solder Bumping, Tin-Lead Eutectic Solder, Lead-Free Solder,
By Industry, Electronics, Heavy Machinery and Equipment, IT and Telecommunication, Automotive, Others
The competitive landscape:
The competitive landscape of the Flip Chip market is a highly crucial section of the report that creates a firm portrait of the market’s key players and their rivalries. A reader can evaluate their position in the market by using this scale of reference, while extensively planning their future movements to counter the movements of the other players in the same areas. This segment provides updated details on companies profiles, business strategies, financial statistics, growth rate and the future scenario for the key leading players in the market, along with the ones that indicate the most positive growth rates.
Why purchase this report?
- Historical inferences, findings & analysis of the Flip Chip market from 2016 to 2018
- Projections and performance forecast analysis for the future from 2019 to 2026
- Production and consumption point of view (POV) analysis
- Flip Chip Market drivers, restraint and opportunity analysis, to define Flip-Chip market dynamics covering industry, regulatory, innovation, technological & pricing trends
- Comprehensive competitive landscape mapping with recent development covering market leadership, competency, sustainability, and prospects
In the end, this report discusses the key drivers influencing the market growth, opportunities, challenges and the risks faced by key players and the Flip-Chip market as a whole. Additionally, It analyzes the emerging trends and their impact on present and future market statistics and development.
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